NTC电阻的规格书

上海甲金通信科技有限公司

AGOLD Communication(Shanghai) Co., Ltd.

带NTC温度检测的电池制作说明

制作:版本: 日期: 2012.03.21

1.文档说明:

本文档是针对我司MT6575项目,配带NTC温度检测电池制作说明。在这以前我司的项目配用的电池都是不带NTC检测的,为了让提高智能机检测电池电量的准确性,必须获得电池的温度,通过软件的运算可以让手机能够准确的显示当前电池的百分比。我司要求MT6575平台的项目都要增加NTC温度检测,该文档就是说明和以前电池内部短路不同的地方。

2.引脚定义:

带NTC温度检测的电池一般要有3个引脚,这3个引脚的功能分别是电池正极、电池负极、电池的ID引脚定义顺序要根据不同项目有所不同,要具体确认。

3.电池内部接线:

带NTC的电池和一般的电池最大的不区别就是ID Pin和电池的负极之间加一个NTC器件,这个器件我司指定使用47K的,当然不能用固定电阻替代,因为NTC的阻值是随温度变化而变化的,只有这样才能检测到电池的实际温度。

4.NTC的选型:

我司目前验证过的NTC型号为 顺络的SDNT1005X473F4100FTF(联系方式:杨蕊:[1**********],

,请务必使用这个料。以后等验证新的代用料在做更新。在电池021-33674648,)

打样期间要将样品寄到我司验证,验证合格后才能批量生产。

5.NTC物料的具体参数:

1. Scope

This specification applies to SDNT1005X473F4100FTF of chip NTC thermistors. 2.

Product Description and Identification (Part Number) 1) Description

Example:

NTC,1005,47KOhm±1%,4100K±1%. 2)

Product Identification (Part Number)

① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ① Type NTC

③ Internal Code

X

② External Dimensions (L×W) [mm]

1005 [0402]

1.0×0.5

④ Nominal Zero-Power Resistance (KΩ)

⑤ Resistance Tolerance

⑦ B Constant Tolerance

⑨ HSF Products

Hazardous Substance Free Products

⑥ Nominal B Constant (25℃ to 50℃)

⑧ Packaging

T

Tape & Reel

3. Electrical Characteristics

Max. Permissive

Part Number

Resistance at 25℃R25 (kΩ)

B constant (25-50℃) (K)

Operating Current (25℃)

(mA)

TYPICAL ELECTRICAL CHARACTERISTICS

1) 2)

Operating and storage temperature range (individual chip without packing): -55℃ ~ +125℃ Storage temperature range (packing conditions): -10℃~+40℃ and RH 75% (Max.)

0.12

Dissipation Factor Constant

(mW/℃)

Rated Electric Power (mW)

4. Shape and Dimensions

1) Dimensions: See Fig.4-1 and Table 4-1. 2)

Fig. 4-1

1005 [0402] 5.

Test and Measurement Procedures 5.1 Test Conditions

1.0±0.15 [0.039±0.006]

0.5±0.15 [0.020±0.006]

[Table 4-1] 0.5±0.15 [0.020±0.006]

0.25±0.1 [0.010±0.004]

Recommended PCB pattern for reflow soldering: See Fig.4-2 and Table 4-1.

Fig. 4-2

Unit: mm [inch]

5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:

a. Ambient Temperature: 20±15℃ b. c.

Relative Humidity : 65±20% Air Pressure: 86kPa to 106kPa

5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:

a. Ambient Temperature: 20±2℃ b. c.

5.2 Visual Examination

a.

Inspection Equipment: 20× magnifier Relative Humidity: 65±5% Air Pressure: 86kPa to 106kPa

5.3.5 Rated Power 5.3.6 Permissive operating current

Refer to Item 3 Refer to Item 3

The necessary electric power makes thermistor’s temperature rise 100℃ by self-heating at ambient temperature 25℃.

The current that keep body temperature of chip NTC on the PC board in still air rising 1°C by self-heating.

5.4 Reliability Test

Sunlord Specifications for Chip NTC Thermistor

Page 6 of 8

6. Packaging and Storage

6.1 Packaging

6.1.1 Tape Carrier Packaging:

Packaging code: T

a. Tape carrier packaging are specified in attached figure Fig.6.1-1~3 b. Tape carrier packaging quantity please see the following table:

(1). Taping Drawings (Unit: mm)

Remark: The sprocket holes are to the right as the tape is pulled toward the user.

(2) Taping Dimensions (Unit: mm)

Direction of Feed

Chip Cavity

max1005[0402]

0.65±0.1

Fig 6.1-2 4.3±0.2mm

(3) Reel Dimensions (Unit: mm)

6.2 Storage

a. b. c. d.

The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less.

The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S)

Packaging material may be deform-ed if package are stored where they are exposed to heat of direct sunlight.

Solderability specified in Clause 5.4.6 shall be guaranteed for 3 months from the date of delivery on condition that they are stored at the environment specified in Clause 3 .For those parts, which passed more than 3 months shall be checked solder-ability before use.

7. Recommended Soldering Technologies

7.1 Re-flowing Profile:

△ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃

△ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max

[Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the

Reflow profile shows.]

7.2 Iron Soldering Profile.

△ Iron soldering power: Max. 30W △ Pre-heating: 150℃/60sec.

△ Soldering Tip temperature: 350℃ Max. △ Soldering time: 3sec. Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering

[Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.]

25℃

10.0±1.5mm

4.0±0.1mm 5.0±0.1mm

Fig. 6.1-3

[**************]Tc

8. Supplier Information

a) Supplier:

Shenzhen Sunlord Electronics Co., Ltd. b) Manufacturer:

Shenzhen Sunlord Electronics Co., Ltd. c) Manufacturing Address:

Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China Zip: 518110

上海甲金通信科技有限公司

AGOLD Communication(Shanghai) Co., Ltd.

带NTC温度检测的电池制作说明

制作:版本: 日期: 2012.03.21

1.文档说明:

本文档是针对我司MT6575项目,配带NTC温度检测电池制作说明。在这以前我司的项目配用的电池都是不带NTC检测的,为了让提高智能机检测电池电量的准确性,必须获得电池的温度,通过软件的运算可以让手机能够准确的显示当前电池的百分比。我司要求MT6575平台的项目都要增加NTC温度检测,该文档就是说明和以前电池内部短路不同的地方。

2.引脚定义:

带NTC温度检测的电池一般要有3个引脚,这3个引脚的功能分别是电池正极、电池负极、电池的ID引脚定义顺序要根据不同项目有所不同,要具体确认。

3.电池内部接线:

带NTC的电池和一般的电池最大的不区别就是ID Pin和电池的负极之间加一个NTC器件,这个器件我司指定使用47K的,当然不能用固定电阻替代,因为NTC的阻值是随温度变化而变化的,只有这样才能检测到电池的实际温度。

4.NTC的选型:

我司目前验证过的NTC型号为 顺络的SDNT1005X473F4100FTF(联系方式:杨蕊:[1**********],

,请务必使用这个料。以后等验证新的代用料在做更新。在电池021-33674648,)

打样期间要将样品寄到我司验证,验证合格后才能批量生产。

5.NTC物料的具体参数:

1. Scope

This specification applies to SDNT1005X473F4100FTF of chip NTC thermistors. 2.

Product Description and Identification (Part Number) 1) Description

Example:

NTC,1005,47KOhm±1%,4100K±1%. 2)

Product Identification (Part Number)

① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ① Type NTC

③ Internal Code

X

② External Dimensions (L×W) [mm]

1005 [0402]

1.0×0.5

④ Nominal Zero-Power Resistance (KΩ)

⑤ Resistance Tolerance

⑦ B Constant Tolerance

⑨ HSF Products

Hazardous Substance Free Products

⑥ Nominal B Constant (25℃ to 50℃)

⑧ Packaging

T

Tape & Reel

3. Electrical Characteristics

Max. Permissive

Part Number

Resistance at 25℃R25 (kΩ)

B constant (25-50℃) (K)

Operating Current (25℃)

(mA)

TYPICAL ELECTRICAL CHARACTERISTICS

1) 2)

Operating and storage temperature range (individual chip without packing): -55℃ ~ +125℃ Storage temperature range (packing conditions): -10℃~+40℃ and RH 75% (Max.)

0.12

Dissipation Factor Constant

(mW/℃)

Rated Electric Power (mW)

4. Shape and Dimensions

1) Dimensions: See Fig.4-1 and Table 4-1. 2)

Fig. 4-1

1005 [0402] 5.

Test and Measurement Procedures 5.1 Test Conditions

1.0±0.15 [0.039±0.006]

0.5±0.15 [0.020±0.006]

[Table 4-1] 0.5±0.15 [0.020±0.006]

0.25±0.1 [0.010±0.004]

Recommended PCB pattern for reflow soldering: See Fig.4-2 and Table 4-1.

Fig. 4-2

Unit: mm [inch]

5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:

a. Ambient Temperature: 20±15℃ b. c.

Relative Humidity : 65±20% Air Pressure: 86kPa to 106kPa

5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:

a. Ambient Temperature: 20±2℃ b. c.

5.2 Visual Examination

a.

Inspection Equipment: 20× magnifier Relative Humidity: 65±5% Air Pressure: 86kPa to 106kPa

5.3.5 Rated Power 5.3.6 Permissive operating current

Refer to Item 3 Refer to Item 3

The necessary electric power makes thermistor’s temperature rise 100℃ by self-heating at ambient temperature 25℃.

The current that keep body temperature of chip NTC on the PC board in still air rising 1°C by self-heating.

5.4 Reliability Test

Sunlord Specifications for Chip NTC Thermistor

Page 6 of 8

6. Packaging and Storage

6.1 Packaging

6.1.1 Tape Carrier Packaging:

Packaging code: T

a. Tape carrier packaging are specified in attached figure Fig.6.1-1~3 b. Tape carrier packaging quantity please see the following table:

(1). Taping Drawings (Unit: mm)

Remark: The sprocket holes are to the right as the tape is pulled toward the user.

(2) Taping Dimensions (Unit: mm)

Direction of Feed

Chip Cavity

max1005[0402]

0.65±0.1

Fig 6.1-2 4.3±0.2mm

(3) Reel Dimensions (Unit: mm)

6.2 Storage

a. b. c. d.

The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less.

The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S)

Packaging material may be deform-ed if package are stored where they are exposed to heat of direct sunlight.

Solderability specified in Clause 5.4.6 shall be guaranteed for 3 months from the date of delivery on condition that they are stored at the environment specified in Clause 3 .For those parts, which passed more than 3 months shall be checked solder-ability before use.

7. Recommended Soldering Technologies

7.1 Re-flowing Profile:

△ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃

△ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max

[Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the

Reflow profile shows.]

7.2 Iron Soldering Profile.

△ Iron soldering power: Max. 30W △ Pre-heating: 150℃/60sec.

△ Soldering Tip temperature: 350℃ Max. △ Soldering time: 3sec. Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering

[Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.]

25℃

10.0±1.5mm

4.0±0.1mm 5.0±0.1mm

Fig. 6.1-3

[**************]Tc

8. Supplier Information

a) Supplier:

Shenzhen Sunlord Electronics Co., Ltd. b) Manufacturer:

Shenzhen Sunlord Electronics Co., Ltd. c) Manufacturing Address:

Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China Zip: 518110


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